"Kaynes, Perceptives, and Sastra Sign MoU to Boost Semiconductor Capacity Building"

Sastra Deemed University in Thanjavur, Tamil Nadu, has signed a Memorandum of Understanding (MoU) with Mysuru-based Kaynes Semicon and IT firm Perceptives Solutions to enhance capacity building in the semiconductor sector. The agreement, finalized on Saturday, will establish a Centre of Excellence focused on advanced chip packaging.

Raghu Panicker, CEO of Kaynes Semicon, emphasized the importance of developing human resources for India's semiconductor industry, stating, "Building human resources for the semiconductor industry is key to the success of India’s semiconductor manufacturing growth story." He noted that the global semiconductor packaging market, valued at approximately $47.22 billion in 2024, is projected to grow to $79.37 billion by 2029, at a CAGR of 10.95%.

Panicker urged graduates to stay updated on developments in semiconductor technology, highlighting that India's share in the global packaging market is expected to rise as more advanced facilities are established domestically.

K. Bhanupriya, Managing Director of Perceptives Solutions, pointed out the necessity for skilled professionals to meet the growing demand in various sectors, including consumer goods, automotive, and high-power computing. He stated, "Trained manpower to fill the talent gap in semiconductor packaging technologies will be an asset for India’s demographic dividend."

The MoU also outlines the creation of the Kaynes – Perceptives – Sastra Packaging Training Academy, which will include a QFN Prototype Line and a clean room facility.

Dr. S. Vaidhyasubramaniam, Vice-Chancellor of Sastra, expressed commitment to developing the training academy into a world-class institution. He also highlighted Sastra's successful collaborations with companies such as Tata Electronics, Delta Electronics, Global Foundries, and several Taiwanese universities, underscoring the university's efforts to strengthen the semiconductor value chain in India.

HBL