RRP Electronics Partners with Taiwan’s AMB for Memory Chip Production.

RRP Electronics, a prominent player in the semiconductor industry, has entered into a Memorandum of Understanding (MoU) with AMB, a Taiwan-based company, to produce advanced memory modules, including SPI NAND, Micro SD, eMMC, and SSD technologies. This partnership is expected to generate $25 million in annual revenue, marking a significant milestone in the global semiconductor ecosystem.

Under the agreement, RRP Electronics will collaborate with AMB on various aspects of memory module production, including technology sharing, package structure design, substrate designs, test program development, and tool design support.

The new memory solutions will offer capacities starting from 2GB and are designed to meet the growing global demand for high-performance electronics. Rajendra Chodankar, Chairman of RRP Electronics, emphasized that this collaboration will enable the company to deploy cutting-edge technology at its Outsourced Semiconductor Assembly and Test (OSAT) facility, serving major global players such as Samsung.

The production will take place at RRP Electronics' 40,000 sq. ft. OSAT facility located in Mahape, on the outskirts of Mumbai. To further meet the increasing demand, the company is expanding its manufacturing capabilities with additional production lines at a new plant in MIDC, Taloja, which is set to begin operations within two years.

HBL