Published On:February 16 2024
Story Viewed 1047 Times

"Rajeev Chandrasekhar Announces Rs 25K Crore Semiconductor Packaging Plant Coming to Assam"

Union Minister of State for Electronics and Information Technology, Rajeev Chandrasekhar, revealed plans for an upcoming semiconductor packaging facility in Assam during the Digital India Future Skills summit in Guwahati on Thursday. The proposed project, with an estimated investment of Rs. 25,000 crore, is being considered, with the proposal coming from the Tatas.

Chandrasekhar stated, "I want to share with you today that Assam is soon going to have a Rs. 25,000 crore semiconductor packaging plant come up in the state. It is a proposal from the Tatas that has to be evaluated."

This announcement follows Assam Chief Minister Himanta Biswa Sarma's revelation last December regarding Tata Group's intentions to invest in a semiconductor facility in the state. Sarma had announced Tata Group's plans to establish a semiconductor processing plant in Assam with an investment of Rs 40,000 crore, which he described as a potential game-changer.

The decision to pursue semiconductor investments in Assam was prompted by the state cabinet's approval of a semiconductor policy in August of the previous year.

Chandrasekhar made the announcement during his address at the first edition of the Digital India Future Skills Summit, organized in collaboration between the Ministry of Electronics and Information Technology (MeitY) and the National Institute of Electronics and Information Technology (NIELIT), in Guwahati.

The summit, expected to draw over 1,000 delegates and attendees, including industry leaders, experts, and academia, aims to explore opportunities for skill development and future technological advancements.

In a social media post, Chandrasekhar expressed, "Addressed the first-ever Digital India Future Skills Summit, with participation of global tech giants and shared how this opens up huge opportunities for students and young Indians to grab, succeed and pave the way for the creation of a talent pool that will power the future of Tech and Tech companies."

The summit is set to witness over 20 strategic collaborations between NIELIT and industry leaders such as Intel, HCL, Microsoft, Kindryl, IIM Raipur, IIITM Gwalior, and Wipro, among others, according to an official press release.

BS





OUR OTHER PRODUCTS & SERVICES: Projects Database | Tenders Database | About Us | Contact Us | Terms of Use | Advertise with Us | Privacy Policy | Disclaimer | Feedback

This site is best viewed with a resolution of 1024x768 (or higher) and supports Microsoft Internet Explorer 4.0 (or higher)
Copyright © 2016-2026

Technology Partner - Pairscript Software